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| 3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT4PR060-BL HIGH POWER AUTOMATIVE LED ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES MT4PR060-BL HIGH POWER AUTOMATIVE LED Package Dimensions 7.620.5 +1 +2 +4 1 4 7.620.5 +3 2 3 1.5 0.5 2.5 0.40.2 1.550.2 5.080.3 3.0 0.2 4.40.2 7.50.2 5.080.3 Notes: 1. All dimensions are in mm. 2. Tolerance is 0.25mm unless otherwise noted Description LED Chip Part No. Material InGaN/Sapphire Emitting Color Blue Lens Color MT4PR060-BL Water Clear VER.: 01 Date: 2007/08/24 Page: 1/6 MT4PR060-BL Absolute Maximum Ratings at Ta=25 Parameter Power Dissipation Reverse Voltage D.C. Forward Current Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Operating Temperature Range Storage Temperature Range Soldering Temperature (1.6mm from body) Electric Static Discharge Threshold (HBM) HIGH POWER AUTOMATIVE LED Symbol PD VR If If(Peak) Topr. Tstg. Tsld. ESD Rating 120 5 30 100 -40 to +100 -40 to +100 Dip Soldering: 260 Hand Soldering: 350 6000 Unit mW V mA mA V Electrical and Optical Characteristics: Parameter Luminous Intensity Luminous Flux Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Viewing Angle Spectrum Line Halfwidth Symbol IV v Vf p d Ir 2 1/2 Condition If=30mA If=30mA If=30mA If=30mA If=30mA Vr=5V If=30mA If=30mA Min. 500 250 3.0 Typ. 930 Max. Unit mcd 1200 4.0 ------ mlm V nm 465 475 50 60 26 nm A deg nm Notes: 1.The datas tested by IS tester. 2. Customer's special requirements are also welcome. VER.: 01 Date: 2007/08/24 Page: 2/6 MT4PR060-BL Typical Electrical/Optical Characteristic Curves (25 50 40 30 20 10 HIGH POWER AUTOMATIVE LED Ambient Temperature Unless Otherwise Noted) 1500 Relative Luminous Intensity(mcd) 1200 900 600 300 0 Forward Current IF(mA) 2.2 2.6 3.0 3.4 3.8 4.2 Applied Voltage (V) 0.0 20.0 10.0 Forward Current (mA) 30.0 Forward Current VS. Applied Voltage Forward Current VS. Luminous Intensity 50 40 30 20 10 Rj-a=251 Rj-pin=117 0 10 20 30 Forward Current IF(mA) 40 1.0 0.9 0.8 20 40 60 80 100 50 60 70 80 90 0.5 0.3 0.1 0.2 0.4 0.6 0 Ambient Temperature Ta ( ) (TjMax.=110 ) 0.7 Ambient Temperature VS. Forward Current Radiation Diagram VER.: 01 Date: 2007/08/24 Page: 3/6 MT4PR060-BL Specifications for Bin Grading: v(mlm) Bin B C D Min. 250 400 600 HIGH POWER AUTOMATIVE LED Max. 500 800 1200 Specifications for Vf Group: Vf(V) Bin V8 V9 V10 V11 V12 Min. 3.0 3.2 3.4 3.6 3.8 Max. 3.2 3.4 3.6 3.8 4.0 Specifications for Wavelength Group: WLD(nm) Bin X4 X5 Min. 465 470 Max. 470 475 VER.: 01 Date: 2007/08/24 Page: 4/6 MT4PR060-BL Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use HIGH POWER AUTOMATIVE LED Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130 . At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/08/24 Page: 5/6 |
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